RDL First WLP Underfill Advanced Packaging Equipment Wafer Level Dispensing Machine

Advanced RDL First WLP Underfill Wafer-Level Dispensing Machine

The evolution of advanced semiconductor devices, such as 2.5D and fan-out wafer-level packaging, demands ultra-reliable underfill processes at the wafer stage. The SS101 is engineered to address these challenges by providing a highly stable dispensing environment within a controlled Class 10 cleanroom-compatible enclosure, supported by precise temperature management and real-time monitoring.

Equipped with an open communication protocol and compliant with international semiconductor ESD standards (IEC & ANSI), the SS101 seamlessly connects with existing factory information management systems — supporting modern smart fab and unmanned operation needs.

Core Advantages

• Optimized for Wafer-Level Underfill: Purpose-built for underfill and CUF processes in advanced fan-out and RDL First packaging scenarios.
• Fully Automated Workflow: Automatic wafer loading/unloading, alignment, preheating, dispensing, heat dissipation, and transfer between stations with robotic handling modules.
• Excellent Cleanroom Compatibility: Support Class 10 operation inside a Class 1000 fab environment.
• Precise Thermal Control: Maintain stable wafer temperatures during critical underfill operations, ensuring reliable flow, curing consistency, and minimal stress on bumps and micro-structures.

Application Areas

✔ RDL First Wafer-Level Packaging (WLP)
✔ Chip Underfill (CUF) Applications
✔ Advanced 2.5D and Fan-Out Packaging
✔ Wafer-Level CoWoS, FoPoP, and similar next-gen processes
✔ High-yield underfill lines for large-volume semiconductor fabs

System Composition

FAQ

Q1: What makes the SS101 different from standard dispensing systems?
A: Unlike general-purpose dispensers, the SS101 is specialized for wafer-level underfill with wafer alignment, preheating, and robotized transfer built in — ensuring uniform filling at micro-bump scales.

Q2: Can the SS101 handle both 8-inch and 12-inch wafers?
A: Yes — it is designed to support both sizes, with 12-inch FOUP compatibility as standard and optional 8-inch open cassette configuration.

Q3: How does the SS101 help reduce wafer contamination?
A: Its Class 10 dispensing zone and seamless robot handling minimize manual intervention, dust ingress, and ESD risk.

Q4: Is the SS101 easy to integrate into existing fabs?
A: Absolutely — it supports SEMI-compliant wafer readers, AMHS interfaces, and standard factory communication protocols.

About Mingseal

Mingseal is a globally recognized provider of high-precision dispensing, coating, and wafer-level fluid process solutions. We empower semiconductor, optical, and advanced packaging manufacturers with innovative automation equipment that drives yield, consistency, and smart factory goals. From high-volume wafer underfill to cutting-edge 2.5D integration, Mingseal delivers stable performance, local service, and trusted engineering support worldwide.

Contact Mingseal to discover how the SS101 Wafer-Level Dispensing Machine can take your advanced packaging capabilities to the next level.

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